Kaihanga waahanga : | XCKU3P-2FFVB676I |
---|---|
RoHs Tūnga : | RoHS3 |
Kaihanga / Waitohu : | AMD |
Waehere Stock : | I roto i te taonga |
Whakaahuatanga : | IC FPGA 280 I/O 676FCBGA |
Tuhinga mai i : | Hong Kong |
Ngā Rauemi : | XCKU3P-2FFVB676I.pdf |
Te Ara Tuhi : | DHL/Fedex/TNT/UPS/EMS |
Part No. | XCKU3P-2FFVB676I |
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Kaihanga | AMD Xilinx |
Whakaahuatanga | IC FPGA 280 I/O 676FCBGA |
Whakahaere Toko Whakahaere / RoHS Tūnga | RoHS3 |
He Rahinga Kei te wātea | I roto i te taonga |
Ngā Rauemi | XCKU3P-2FFVB676I.pdf |
Tuhinga o mua | 0.825V ~ 0.876V |
Te tapeke RAM | 31641600 |
Pūrere Pūrere Whakarato | 676-FCBGA (27x27) |
Raupapa | Kintex® UltraScale+™ |
Paa / Case | 676-BBGA, FCBGA |
Pūhera | Tray |
Tae Mahi | -40°C ~ 100°C (TJ) |
Te maha o nga Mea Pono / Pūtau | 355950 |
Te maha o nga LAB / CLB | 20340 |
Tau o I / O | 280 |
Momo Tae | Surface Mount |
Tau hua hua | XCKU3 |